Definition

Sputtering is a kind of preparation technology of PVD (physical vapor deposition) thin film. Sputtering can be mainly divided into four categories: DC sputtering, AC sputtering, reactive sputtering and magnetron sputtering.

Principle

Sputtering uses a high-speed movement of positive ions generated by gas discharge under the action of an electric field to bombard the cathode target, causing atoms or molecules in the solid sputtering target to escape and deposit on the surface of the workpiece to be formed, thereby forming a film.

Use

Electronics industry develops fast and requires high purity and large quality materials. The production of computer hard disks is an important and widespread application of sputtering deposition. Sputtering can also deposit the metal (such as aluminium) layer during the fabrication of CDs and DVDs

Sputtering target is also used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. And those sputtering targets used in semiconductor industries are specially called Anelva targets. Anelva targets can make the surface of metal, alloy or dielectric film on the surface of the base material. Suitable for manufacturing thin film integrated circuit, chip lead device and semiconductor device.

Optical coating, for instance, thin antireflection coatings on glass for optical applications, is also an important application of sputtering can also be used to sputter. Because of the low substrate temperatures used, sputtering is an ideal method to deposit contact metals for thin-film transistors. Another familiar application of sputtering is low-emissivity coatings on glass, used in double-pane window assemblies, which is a multilayer containing silver and metal oxides such as zinc oxide, tin oxide, or titanium dioxide.

A large industry has developed around tool coating using sputtered nitrides, such as titanium nitride, which has the similar color with gold, to create the gold colored hard coat. It is really an economical choice.

Method

Sputtered thin films are usually produced in the plasma of inert gas (such as argon).

Features

The sputtering process has the advantages of low substrate temperature, thin film quality, uniform and compact structure, good firmness and reproducibility. Another important advantage of sputter deposition is that even materials with very high melting points can be easily sputtered.

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